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  Datasheet File OCR Text:
 RGF1A-RGF1M
RGF1A - RGF1M
Features * * * * * *
Glass passivated junction. For surface mounted application. Low forward voltage drop. High current capability. Easy pick and place. High surge current capability.
3.93 3.73
0.181 (4.597) 0.157 (3.988) 0.062 (1.575) 0.055 (1.397)
2
1
0.114 (2.896) 0.098 (2.489)
0.208 (5.283) 0.188 (4.775)
1.67 1.47
SMA/DO-214AC
+
2.38 2.18 5.49 5.29 Minimum Recommended Land Pattern
COLOR BAND DENOTES CATHODE
0.096 (2.438) 0.078 (1.981)
0.060 (1.524) 0.030 (0.762)
0.008 (0.203) 0.002 (0.051)
0.012 (0.305) 0.006 (0.152)
1.0 Ampere Fast Recovery Rectifiers
Absolute Maximum Ratings*
Symbol
IO if(surge) PD RJA RJL Tstg TJ
TA = 25C unless otherwise noted
Parameter
Average Rectified Current @ TL = 125C Peak Forward Surge Current 8.3 ms single half-sine-wave Superimposed on rated load (JEDEC method) Total Device Dissipation Derate above 25C Thermal Resistance, Junction to Ambient ** Thermal Resistance, Junction to Lead** Storage Temperature Range Operating Junction Temperature
Value
1.0
Units
A
30 1.76 11.7 85 28 -65 to +175 -65 to +175
A W mW/C C/W C/W C C
*These ratings are limiting values above which the serviceability of any semiconductor device may be impaired. **Device mounted on FR-4 PCB 0.013 mm.
Electrical Characteristics
Parameter
1A Peak Repetitive Reverse Voltage Maximum RMS Voltage DC Reverse Voltage (Rated VR) Maximum Reverse Current @ rated VR TA = 25C TA = 125C Maximum Forward Voltage @ 1.0 A Maximum Reverse Recovery Time IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A Typical Junction Capacitance VR = 4.0 V, f = 1.0 MHz
1998 Fairchild Semiconductor International
TA = 25C unless otherwise noted
Device
1B 100 70 100 1D 200 140 200 1G 400 280 400 5.0 100 1.3 150 8.5 250 500 1J 600 420 600 1K 800 560 800 1M 1000 700 1000 50 35 50
Units
V V V A A V nS pF
RGF1A-RGF1M, Rev. E
RGF1A-RGF1M
Fast Recovery Rectifiers
(continued)
Typical Characteristics
Forward Current Derating Curve
1.25 FORWARD CURRENT (A)
Non-Repetitive Surge Current
PEAK FORWARD SURGE CURRENT (A) 50
1
40
0.75
RESISTIVE OR INDUCTIVE LOAD P.C.B. MOUNTED ON 0.2 x 0.2" (5.0 x 5.0 mm) COPPER PAD AREAS
30
0.5
20
0.25
10
0
0
25
50 75 100 125 LEAD TEMPERATURE ( C)
150
175
0
1
2
5 10 20 50 NUMBER OF CYCLES AT 60Hz
100
Forward Characteristics
20 10 REVERSE CURRENT ( A) FORWARD CURRENT (A) 30 10
Reverse Characteristics
T A = 150 C
T A = 125 C
1
1
T A = 100 C
TA = 25 C
0.1
Pulse Width = 300s 2% Duty Cycle
0.1
TA = 25 C
0.01 0.4
0.6
0.8 1 1.2 1.4 FORWARD VOLTAGE (V)
1.6
1.8
0.01
0 20 40 60 80 100 120 140 PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
Junction Capacitance
50
CAPACITANCE (pF)
20 10 5
2 1
1
2
5 10 20 REVERSE VOLTAGE (V)
50
100
RGF1A-RGF1M, Rev. E
SMA/DO-214AC Package Dimensions
SMA/DO-214AC (FS PKG Code P5)
1:1
Scale 1:1 on letter size paper
Dimensions shown below are in: inches [millimeters]
Part Weight per unit (gram): 0.064
0.181 (4.597) 0.157 (3.988) 0.062 (1.575) 0.055 (1.397)
3.93 3.73
2
1
0.114 (2.896) 0.098 (2.489)
1.67 1.47
+
2.38 2.18 5.49 5.29
0.208 (5.283) 0.188 (4.775)
0.096 (2.438) 0.078 (1.981)
Minimum Recommended Land Pattern
0.060 (1.524) 0.030 (0.762)
0.008 (0.203) 0.002 (0.051)
0.012 (0.305) 0.006 (0.152)
August 1999, Rev. A
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
ACExTM BottomlessTM CoolFETTM CROSSVOLTTM E2CMOSTM FACTTM FACT Quiet SeriesTM FAST FASTrTM GTOTM
DISCLAIMER
HiSeCTM ISOPLANARTM MICROWIRETM POPTM PowerTrench QFETTM QSTM Quiet SeriesTM SuperSOTTM-3 SuperSOTTM-6
SuperSOTTM-8 SyncFETTM TinyLogicTM UHCTM VCXTM
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. E


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